SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, LEAD FRAME AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a semiconductor device and its manufacturing method in which device adhesion of sealing resin and a member Cu is not decreased when a high temperature is applied in the course of manufacturing and mounting the semiconductor device, in a semiconductor device using a member formed of Cu which is subjected to blackening treatment and its manufacturing method. CONSTITUTION: This semiconductor deice is provided with a leas frame formed of copper (Cu) or copper alloy wherein a blackening treatment layer is disposed on the surface of base substance; a chip fixed to a specified place of the lead frame; a plurality of internal terminals connected electrically with the chip; and sealing resin sealing the lead frame, the chip and the internal terminals. A copper (I) oxide (Cu2O) layer formed by oxidizing the surface of the base substance is disposed between the layer subjected to blackening treatment and the based substance.