METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

摘要

PURPOSE: A method of manufacturing a semiconductor wafer is provided to etch the semiconductor wafer and evade an elevation called an edge gutter. CONSTITUTION: In a semiconductor wafer manufacturing method, an etching medium is made to flow in a laminar in a flow direction toward the edge of a semiconductor wafer at etching, and a protective shield is disposed in front of the edge of the semiconductor wafer, by which the etching medium flows toward the protective shield. Therefore. it is restrained from flowing toward the edge of the semiconductor wafer.