FLAT MAGNETRON SPUTTERING APPARATUS

摘要

PURPOSE: A flat magnetron sputtering apparatus is provided to enable uniform film formation across large area by rotating a permanent magnet unit defining a number of closed circuits in one direction along an elliptical orbit perpendicular to the target surface. CONSTITUTION: A flat magnetron sputtering apparatus includes a target settling unit(14), a cooling unit(16), a permanent magnet closed circuit unit(20) and a rotary unit(30). The target settling unit(14) fixes a cathode target(12) made of metal or ceramic, and includes an insulating Teflon. The cooling unit(16) is arranged in the rear of the target(12) for cooling the target(12). The permanent magnet closed circuit unit(20) is distanced from the target(12) under the cooling unit(16) for forming a number of permanent magnet closed circuits. The rotary unit(30) drives the permanent magnet closed circuit unit(20) to move in one direction along an elliptical orbit perpendicular to the surface of the target(12).