| 摘要 |
PURPOSE: To provide a semiconductor device, with which the number of constitutive layers required for a multilayered substrate is reduced while keeping the location of solder bumps for signal to be connected to the electrodes of a semiconductor chip as conventional. CONSTITUTION: Since a signal line 12 of a first signal layer 9 is guided to a lower multilayered part via a through hole 15 selected on fixed conditions, even when a second signal layer 9 and the first signal layer 9 are overlapped without interposing a plane layer, a crosstalk noise does not become a problem. Besides, since a ground plane 14 is provided at the spot, where the signal line 12 is absent, of the first signal layer 9, even without providing the other plane layer between the first signal line 12 and the second signal layer 12, the second signal layer 12 can be made into strip structure held between planes. Thus, since one plane layer is unnecessitated, as a result, the number of layers required for the multilayered substrate can be reduced.
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