摘要 |
PROBLEM TO BE SOLVED: To provide a cooler for a circuit component arranged to introduce heat from a heat generating component on a circuit board efficiently to the outside of the board and to dissipate heat to the outside of an apparatus from a heat dissipating part comprising heat dissipating fins and a fan disposed on the heat dissipating side of the heat pipe in which cooling efficiency is enhanced significantly while reducing the profile of cooling components. SOLUTION: Two heat pipes 13, 14 are led out from a heat receiving part 12 touching a circuit component 22 on a circuit board 21 to the outside thereof and connected, at the end parts on the heat dissipating side, with different heat dissipating fins 15, 16, respectively. The heat dissipating fins are cooled by means of one fan 17 interposed between.
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