HEAT-CONDUCTIVE SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that a conductor pattern needs be formed as all connected to the external frame of a lead frame and to have extra wiring since the wiring pattern of the lead frame was molded by a punching process using a metallic mold in the conventional method. SOLUTION: A sheet for a heat-conductive substrate containing thermosetting resin and an organic filler is adhered to a surface where the conductor pattern is formed by being cured, an insulating layer is formed, and a metal plane which is not adhered to the heat-conductive substrate sheet is etched to draw the conductor pattern on the top surface, and the cured thermosetting resin is exposed where the conductor pattern is not present and a heat-radiative metal plate is adhered there.