| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deformation or crack of a thermoelectric semiconductor being generated in the manufacturing process of a thermoelectric element. SOLUTION: A liquid insulation resin is injected between combined n-type and p-type thermoelectric semiconductors having a substrate part, and then is half cured into a gel-shaped solid. Then, after the substrate part of the combined thermoelectric semiconductors is removed, the insulation resin is cured completely. Therefore, even if the insulation resin shrinks, no strong stress is applied to the thermoelectric semiconductors since the substrate made of thermoelectric semiconductor materials has already been removed, thus preventing the combined thermoelectric semiconductors from being deformed or cracked.
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