| 摘要 |
PROBLEM TO BE SOLVED: To provide a pair wiring which constitutes a differential circuit causing no crosstalk noise, related to a multilayer interconnection board comprising orthogonal parallel wirings. SOLUTION: On a first insulating layer I1 comprising a first parallel wirings L1, a second insulating layer I3 comprising a second parallel wirings L2 orthogonal to the L1 and a third insulating layer I3 comprising a third parallel wirings L3 orthogonal to the L2 are laminated, which are electrically connected together with through conductors T, thus a laminated wiring body is provided. The first parallel wiring L1 comprises a paired signal wiring SP1 comprising two signal wirings adjoining each other and an adjoining power source wiring P1 or a ground wiring G1. The third parallel wirings L3 comprises two power source wirings P3 facing the paired signal wiring SP1 and/or a ground wiring P3. Thus, a differential circuit of good characteristics using paired wiring causing no crosswalk noise is provided.
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