| 摘要 |
PROBLEM TO BE SOLVED: To relieve stress in a connection part which is caused by thermal expansion coefficient difference between a semiconductor ship and a mounting substrate. SOLUTION: In this substrate formed by this manufacturing method, the semiconductor chip is mounted on a mounting substrate via posts having cores which are composed of flexible resin and protruded from the substrate. As a result, the stress caused by the thermal expansion coefficient difference between the semiconductor chip and the mounting substrate is relieved.
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