RESIN SEALING MOLD AND MANUFACTURING METHOD FOR RESIN SEALED SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve a problem that a circuit board is broken down so as to generate scraps at a time when the circuit board on which a chip is mounted is resin-sealed and at a time when a mold is closed. SOLUTION: The mold is composed of an upper mold 1 and lower mold 5. Edge-shaped protrusions 13 are arranged on both sides of a runner 2. When the circuit board 7 is sandwiched between the upper mold 1 and the lower mold 5 so as to perform a resin sealing operation, end parts of the circuit board 7 are pushed and cut by the edge-shaped protrusions 13 so as to be crushed. A state that an opening 9 is closed by the protrusion and by the end parts of the crushed and swollen circuit board 7 is formed. A resin leak is prevented. Since the ends of the circuit board 7 are pushed and cut so as to be crushed, it is possible to realize the resin-sealed semiconductor device which eliminates that a solder resist and a resin layer on the surface of the circuit board 7 are broken into pieces, which suppresses the breakdown of the circuit board to a minimum, which prevents the generation of the scraps and which is of good quality.