| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is difficult to decrease the on-resistance between leads even if a semiconductor pellet having a low on-resistance is used. SOLUTION: In a semiconductor device where an electrode 3 on a semiconductor pellet 1 passing a main current is connected electrically with an putter lead 7b through a conductive foil 11, a conductive paste 14 dispersed with a conductive member 15 is placed between the electrode 3 and the conductive foil 11. A recess 13 exposing the electrode base 3a is made in the surface of the electrode 3 and brought into tight electrical contact with the conductive member 15 contained in the conductive paste 14 thus connecting electrically the electrode 3 passing the main current with the conductive foil 11. |
