| 摘要 |
PROBLEM TO BE SOLVED: To prevent a plurality of semiconductor wafers which are reduced in thickness and increased in diameter from being broken when the wafers are set on or removed from a turntable before and after the wafers are polished or while the wafers are polished, and to make the qualities of the wafers uniform by eliminating the variation of polishing accuracy after polishing at the time of simultaneously polishing the wafers by holding the wafers between a lower turntable having a relatively large diameter and an upper turntable having nearly the same diameter. SOLUTION: Polished semiconductor wafers are removed from a fully automatic two-platen polishing device by providing a first polishing means at the position of a head positioned perpendicularly to the turning direction of a column at the position of a head to which the semiconductor wafers transferred by means of a feeding-side transferring means are attached, a second polishing means below the position of a head positioned perpendicularly to the turning direction of a column at the position of a head positioned above the first polishing means, and a transferring means for cleaning near the position of a head positioned perpendicularly to the turning direction of a column at the position of a head positioned above the second polishing means. |
