| 摘要 |
PROBLEM TO BE SOLVED: To settle the situation where, related to a circuit device on which circuit elements are mounted, with a printed board, a ceramics board, a flexible sheet, and the like as support boards, the support boards are extra materials and not required and that the thickness of the support board enlarges the circuit device. SOLUTION: After a separation channel 54 is formed at a conductive foil 60, a circuit element is mounted, and an insulating resin 50 is coated with the conductive foil 60 as a support board, which is inverted before the conductive foil is polished with the insulating resin 50 as the support board, for a separate conductive path. Thus, with no support board employed, a circuit device where a conductive path 51 and a circuit element 52 are supported by the insulating resin 50 is provided. The side surface of the conductive path 50 is bent to cause an anchor structure, preventing falling of the conductive path. |
