发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and this semiconductor device which reveals good characteristics on a substrate inferior in heat resistance. SOLUTION: The semiconductor device is manufactured by forming a silicon film on a first insulation film formed on a substrate, heating the silicon film to form a crystalline silicon film, selectively etching the crystalline silicon film to form an island-like crystalline silicon film, oxidating at least the upside and the side face of the island-like crystalline silicon film to form a silicon oxide film, forming a second insulation film by the CVD method with covering at least this silicon oxide film, and forming a gate electrode on the second insulation film.</p>
申请公布号 JP2001217432(A) 申请公布日期 2001.08.10
申请号 JP20000391469 申请日期 2000.12.22
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 ADACHI HIROKI;TAKEUCHI AKIRA;FUKADA TAKESHI;UEHARA HIROSHI;TAKEMURA YASUHIKO
分类号 G02F1/136;G02F1/1368;H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 主分类号 G02F1/136
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