发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and this semiconductor device which reveals good characteristics on a substrate inferior in heat resistance. SOLUTION: The semiconductor device is manufactured by forming a silicon film on a first insulation film formed on a substrate, heating the silicon film to form a crystalline silicon film, selectively etching the crystalline silicon film to form an island-like crystalline silicon film, oxidating at least the upside and the side face of the island-like crystalline silicon film to form a silicon oxide film, forming a second insulation film by the CVD method with covering at least this silicon oxide film, and forming a gate electrode on the second insulation film.</p> |
申请公布号 |
JP2001217432(A) |
申请公布日期 |
2001.08.10 |
申请号 |
JP20000391469 |
申请日期 |
2000.12.22 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ADACHI HIROKI;TAKEUCHI AKIRA;FUKADA TAKESHI;UEHARA HIROSHI;TAKEMURA YASUHIKO |
分类号 |
G02F1/136;G02F1/1368;H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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