| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and its manufacturing method which can provide a fine circuit board without increasing manufacturing manhour. SOLUTION: This manufacturing method of a circuit board is provided with a process for forming pillar type conductors 18a on a substrate 10, a process for thermocompression-bonding a resin sheet 36 containing a layer composed of thermosetting or thermoplastic resin on the substrate on which the pillar type conductors are formed, and forming an insulating film 20 composed of resin which covers the upper surface of the substrate and is formed on at least the side surfaces of the pillar type conductors, and a process for forming a wiring layer connected with the pillar type conductors on the insulating film. |
