SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enhance the reliability of connection of a bump electrode as an external terminal. SOLUTION: The semiconductor device is composed of a tape substrate 2 which supports a semiconductor chip 1. The semiconductor device is composed of a bonding material 5 which is arranged between the semiconductor chip 1 and the tape substrate 2, which is formed in a circular shape and which bonds the semiconductor chip 1 and the tape substrate 2. The semiconductor device is composed of bonding wires 4 which connect pads 1a of the semiconductor chip 1 to connecting terminals 2c of the tape substrate 2. The semiconductor device is composed of a plurality of bump electrodes 3 which are installed on the rear 2b of the tape substrate 2. The semiconductor device is composed of stress relaxation parts 7 which are formed in places corresponding to at least circumferential bump electrodes 3a in chip support regions between the semiconductor chip 1 and the tape substrate 2, which are formed in places corresponding to chip corner parts and which relax a stress applied to the bump electrodes 3. The semiconductor device is composed of a sealing part 6 which is formed by resin-sealing the semiconductor chip 1. Thermal stress which is applied to the bump electrodes 3 near the chip corner parts and to the outermost circumferential bump electrodes 3a is realized by the stress relaxation parts 7.