| 摘要 |
PROBLEM TO BE SOLVED: To stably mount a module substrate on a mother board by suppressing the curvature of the substrate and to increase the strength of joining with the mother board. SOLUTION: On an end surface 1C of the substrate 1, an end-surface through hole 3 consisting of an end-surface opening groove, an end-surface electrode, etc., is provided, and in the end-surface through hole 3 end-surface solder 8 which projects toward the reverse surface 1B of the substrate 1 is fitted. On a corner part side of the substrate, a beveled part 9 is provided and to the beveled part 9, a beveled-part through hole 10 is provided; and a beveled part through hole 15 which projects toward the reverse surface 1B of the substrate 1 is fitted to the beveled-part through hole 10. The beveled part 9 and beveled- part through hole 10 can suppress the curvature of the substrate 1, and respective end-surface and beveled-part electrodes are soldered to electrode pads of the mother board to increase the joining strength between them.
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