| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer interconnection board suitable for an electronic circuit board for electronic components, a package and the like operating at a high speed, provided with a pair wiring constituting a differential circuit causing no crosstalk noise, related to a multilayer interconnection board comprising orthogonal parallel wirings. SOLUTION: On a first insulating layer I1 comprising a first parallel wirings L1, a second insulating layer I2 comprising a second parallel wirings L2 orthogonal to the L1 is laminated, with the first and second parallel wirings L1 and L2 electrically connected together with through conductors T, providing a laminated wiring board. The L1 and L2 comprise paired signal wirings SP1 and SP2 comprising two signal wirings adjoining each other and adjoining power- source wirings P1 and P2 or ground wirings G1 and G2. Thus, a differential circuit of good characteristics using paired wiring causing no crosstalk noise is provided.
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