SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the connection strength between an external terminal of a semiconductor device and a wiring board without enlarging the semiconductor device. SOLUTION: A plurality of bump electrodes 1BB1 where the dimension in the direction across a side of an interposer board 1Bi is longer than that in the direction along the side of it are provided around the perimeter of the rear surface of the interposer board 1Bi where a semiconductor chip constituting a semiconductor device 1 of CSP type is mounted.