SEMICONDUCTOR DEVICE WITH VIAHOLE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device equipped with a viahole which is filled up with a metal plug completely arranged within the border of a wiring and improved in reliability. SOLUTION: This manufacturing method comprises a first process in which a first interlayer insulating film 17 is formed on a first wiring layer 16 formed on a semiconductor substrate 1, a second process in which the first interlayer insulating film 17 is planarized so as to make its top surface flush with that of the first wiring layer 16, a third process in which an etching stop layer 18 is formed on the first interlayer insulating film 17 and the first wiring layer 16, a fourth process in which an oxide film 19 is formed on the etching stop layer 18, and a fifth layer in which the oxide film 19 and the etching stop layer 18 are etched by two steps, and a viahole 9 is formed. The first wiring layer 16 can be connected through the intermediary of the viahole 9.