| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate connecting device of simple constitution which can electrically connect >=2 substrates with ease and fix an inserted substrate so that it will not move unexpectedly in an engagement opening part of an insertion-destination substrate. SOLUTION: A 1st substrate 1 has a nonlinear groove 2, and at its projection part a land pattern part 4 for soldering is formed. A 2nd substrate 3 is engaged with the groove 2 of the 1st substrate 1 and soldered so that its conduction part is electrically connected to the land pattern 4.
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