发明名称 HIGH MOLECULAR COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
摘要 PROBLEM TO BE SOLVED: To obtain a high molecular compound for a photoresist excellent in adhesion to a substrate and capable of accurately forming a fine pattern. SOLUTION: The high molecular compound contains a monomer unit to formula I and may further contain at least one monomer unit selected from the units of formulae IIa-IIg (where R1 and R13-R15 are each H or methyl; R2 and R3 are each a 1-8C hydrocarbon group; R4-R6 are each H, hydroxyl or methyl; R7 and R8 are each H, hydroxyl or -COOR9; R9 is t-butyl, 2- tetrahydropyanyl or the like; R10 and R11 are each H, hydroxyl or oxo; R12 is a hydrocarbon group having a tertiary carbon atom in a bond position to an oxygen atom shown in each formula; R16 is t-butyl, 2-tetrahydropyranyl or the like; and (n) is an integer of 1-3).
申请公布号 JP2001215703(A) 申请公布日期 2001.08.10
申请号 JP20000024527 申请日期 2000.02.01
申请人 DAICEL CHEM IND LTD 发明人 FUNAKI KATSUNORI;TSUTSUMI KIYOHARU;HORAI AKIRA
分类号 H01L21/027;C08F18/00;C08F20/10;C08F22/06;C08F32/00;C08F32/08;C08F232/02;G03F7/004;G03F7/039 主分类号 H01L21/027
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