METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board which enables suppression of the inter-layer thickness variation, without causing forming failures. SOLUTION: In the method of manufacturing a multilayer printed wiring board, at least a copper-clad laminate board is processed to form circuits and they are laminated on prepregs and formed in one body. They are formed into an integral multilayer board using prepregs impregnated with a resin having a melt viscosity of 100 Pa.s or more at 120-140 deg.C and a curing time of 100 or less at 160-180 deg.C.