| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attachment paste which maintains the characteristic of a conventional die attachment paste and which can be hardened in a very short time. SOLUTION: This die attachment paste is composed of (A) urethane di(metha) acrylate obtained by reacting hydroxyalkyl (metha)acrylic acid, polyalkylene glycol and diisocyanate. The paste is composed of (B) a reactive diluent which comprises a (metha) acryl group. The paste is composed of (C) monoallyldiglycidye isocyanuric acid. The paste is composed of (D) (metha) acrylate which contains phosphorate group. The paste is composed of (E) alkoxysilane which comprises an epoxy group. The paste is composed of (F) an organic peroxide and/or an azo compound. The paste is composed of (G) an inorganic filler. The addition ratio of the component (F) is at 0.1 to 5 wt.% with reference to the total weight of the component (A) the component (B) and the component (C). |
