| 摘要 |
PROBLEM TO BE SOLVED: To improve a structural problem when potting resin is sealed on an LD and a PD in a semiconductor element module structure and further, to a space part in the vicinity of an end surface of an optical fiber. SOLUTION: By imparting relation of +, - to respective leads, a beam is emitted from the end surface of the LD 1, and one side beam attains optical coupling with the optical fiber connected to a V groove of a substrate 3. The other side beam is made incident on a monitor PD 7 positioned to an opposite place through the optical fiber 2 and the LD 1. In such a manner, by attaining respective optical coupling, an optical path 42 is formed. An a part of a space is attained by the potting resin 43 in optical path securance and interruption from an external environment. Further, by the effect of a side wall part of a U-shaped header 10, the potting resin doesn't flow out, and the LD and PD and further, the end surface vicinity of the optical fiber is covered sufficiently.
|
