发明名称 CHIP-TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide chip-type electronic component, the insulation resistance of which can be prevented from being deteriorated, when the parts are left as it is in a high-temperature high-humidity environment, without spoiling its external appearance nor impairing its solder wettability and which can be manufactured using a simple inexpensive method. SOLUTION: In this chip-type electronic components, in which external terminal electrodes 2 and 3 each of which is composed of a thick base conductor layer 31 and a surface plated layer 32 are formed at both end sections of a rectangular ceramic substrate 1, coating films formed with a triazole-based rust prevention formed are formed on the surfaces of the conductor layers 31 or surface plated layers 3 of the electrodes 2 and 3.
申请公布号 JP2001217141(A) 申请公布日期 2001.08.10
申请号 JP20000027397 申请日期 2000.01.31
申请人 KYOCERA CORP 发明人 KOJIMA HIROSHI;MAEDA TAKASHI
分类号 H01G4/12;(IPC1-7):H01G4/12 主分类号 H01G4/12
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