| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high-reliability multilayer wiring board which is usable for portable telephones, etc., and never drops semiconductor elements or electronic components when the board is fallen. SOLUTION: This multilayer wiring board comprises insulation layers 1a-1e containing at least a thermosetting resin, a plurality of conductor wiring layers 2a, 2b formed on the surfaces and/or interiors of the insulation layer 1a-1e, and via conductors 3 of a filled metal powder filled between the conductor wiring layers 2a, 2b. A resin layer 4 containing a rubber component exists on the interfaces of the conductor wiring layers 2a, 2b with the insulation layers 1a-1e. Specifically, the rubber component is composed of grains of 2μm or less in diameter, the thickness of the resin layer 4 containing the rubber component is 2-10μm, and the rubber component content is 5-50 wt.%. |
