| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for transferring a conductive ball wherein a manufacturing cost for a transportation head is reduced while the conductive ball is quickly taken. SOLUTION: The conductive ball 4 is picked up and transferred to a work. Here, the conductive ball 4 supplied in array corresponding to the array of an electrode 3a is picked up by, while sticking to and held by, a lower surface of an adhesive part 8 (a first adhesive surface) of the transferring head 7, and then mounted on an upper surface of the electrode 3a (a second adhesive surface) of a substrate 3 on which a flux 3b is coated. Since the holding power of the second adhesive surface for the conductive ball 4 is set higher than that of the first adhesive surface, the conductive ball 4 remains on the electrode 3a by lifting up the transferring head 7. Thus, with no expensive sucking tool for vacuum suction, the conductive ball is quickly pinked up.</p> |
