| 摘要 |
PROBLEM TO BE SOLVED: To increase the probability of the critical angle incidence of rays, to avoid the shielding of light of an electrode by a flip-chip system, and to increase the emission efficiency of a while light-emitting diode using a submount that is made of a material having a high heat transfer rate. SOLUTION: A transparent substrate that includes a submount having a light-emitting diode chip, a transparent substrate, a transparent ohmic electrode, a reflection mirror, a contact electrode, and a conductive wire and has a rough surface is arranged on the first surface of the diode chip, the transparent ohmic electrode is arranged on the second surface of the diode chip, the reflection film is formed on the transparent ohmic electrode, the diode chip is arranged on the submount with a high heat transfer property via the contact electrode and the solder paste, and a fluorescent resin body that absorbs one portion of rays and changes white light to visible rays while emitting rays with complementary color is provided at the upper portion of the diode chip. |
