| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an electronic at high yield and with good efficiency by preventing the damage of a substrate at a time when the substrate which is easy to damage is resin-sealed by using a mold. SOLUTION: The substrate 1 on which respective chips 4 are mounted in respective individual regions 2 is pasted on an adhesive tape 6. The adhesive tape 6 is placed on a lower mold 12. The lower mold 12 and an upper mild 14 are closed without clamping the substrate 1 and by clamping the adhesive tape 6. A molten resin (not shown in the figure) is injected into a cavity 15, and it is hardened. The lower mold 12 and the upper mold 14 are then opened. A resin molded body 18 on which the adhesive tape 6 is pasted is taken out. The resin molded 18 is pilled out from the adhesive tape 6, it is turned over, it is pasted on an adhesive tape 20 for cutting, it is conveyed so as to be fixed to a stage 19 in a separation mechanism, and it is cut by a blade 22. As a result a plurality of electronic components which are composed of the individual regions 2, the chips 4 installed respectively on the individual regions 2 and a sealing resin 17 are completed. |
