发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring both high film-leaving property and enhanced sensitivity in practical use. SOLUTION: In the photosensitive resin composition containing an alkali- soluble resin and a quinonediazido-containing photosensitive agent, the photosensitive agent is contained by a smaller amount than the amount of a conventional photosensitive agent, that is, 1-20 pts.wt. based on 100 pts.wt. resin in the composition and the velocity of dissolution of the composition in 2.38 wt.% aqueous tetramethylammonium hydroxide solution is adjusted to <= 5,000 &angst;/min. This velocity can be attained by adding (a) an alkali-insoluble polyacrylic ester, polymethacrylic ester or polystyrene derivative, (b) a copolymer obtained from at least two monomers selected from acrylic esters, methacrylic esters and styrene derivatives, (c) a copolymer of the monomers and an organic acid such as a polyacrylic acid or (d) a mixture of the alkali-insoluble polymer and an organic acid polymer by 1-10 pts.wt. based on 100 pts.wt. alkali-soluble resin in the composition, e.g. novolak resin.
申请公布号 JP2001215696(A) 申请公布日期 2001.08.10
申请号 JP20000045430 申请日期 2000.02.23
申请人 CLARIANT (JAPAN) KK 发明人 TAKAHASHI SHUICHI
分类号 H01L21/027;C08L101/00;G03F7/023 主分类号 H01L21/027
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