发明名称 |
ELECTRONIC PARTS AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide electronic parts innovated for the purpose of improving productivity with high reliability and eliminating large-sized system structure on which the parts are mounted. SOLUTION: A first region including at least a single-layered first is formed on a first substrate 1, and a second region is formed on a second substrate 8. The second substrate 8 is mounted on the first substrate 1 on which the second region is constituted.</p> |
申请公布号 |
JP2001217411(A) |
申请公布日期 |
2001.08.10 |
申请号 |
JP20000027675 |
申请日期 |
2000.02.04 |
申请人 |
SHARP CORP |
发明人 |
NISHIMURA YASUNORI;TAGUSA YASUNOBU;TANIGAWA TORU |
分类号 |
G02F1/136;G02F1/1368;H01L21/02;H01L21/336;H01L27/00;H01L27/12;H01L29/786;H05K1/14;(IPC1-7):H01L27/12 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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