发明名称 ELECTRONIC PARTS AND MANUFACTURING METHOD THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide electronic parts innovated for the purpose of improving productivity with high reliability and eliminating large-sized system structure on which the parts are mounted. SOLUTION: A first region including at least a single-layered first is formed on a first substrate 1, and a second region is formed on a second substrate 8. The second substrate 8 is mounted on the first substrate 1 on which the second region is constituted.</p>
申请公布号 JP2001217411(A) 申请公布日期 2001.08.10
申请号 JP20000027675 申请日期 2000.02.04
申请人 SHARP CORP 发明人 NISHIMURA YASUNORI;TAGUSA YASUNOBU;TANIGAWA TORU
分类号 G02F1/136;G02F1/1368;H01L21/02;H01L21/336;H01L27/00;H01L27/12;H01L29/786;H05K1/14;(IPC1-7):H01L27/12 主分类号 G02F1/136
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