| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, especially a noncontact recognition device utilizing a thin semiconductor chip, and the structure and manufacturing method of a semiconductor device for producing efficiently. SOLUTION: A semiconductor device is manufactured by applying adhesive resin previously to a thin chip 12 and connecting a thin chip 13 with the electrode on a film substrate 23 while clamping the symmetrically designed film substrate 23 having electrodes and provided with an antenna 11 vertically. Labor can be reduced and incidental facilities can be rationalized by performing connection under wafer state, winding the film substrate into rolls 21, 22 and then cutting the roll into individual chips.</p> |
