| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a semiconductor element protection film that has high heat resistance, dimensional stability, and insulation properties and can form uniform and small bubbles, a porous resin for protecting semiconductor elements that is obtained by the photosensitive resin composition for forming the semiconductor element protection film, and a semiconductor device where the porous resin for protecting semiconductor elements is used. SOLUTION: As a photosensitive resin composition 3 for forming a semiconductor element protection film, a polyamic acid resin, a photosensitizer, a dispersive compound 4 that can be dispersed to the polyamic acid resin, and a solvent are contained. The dispersive compound 4 that dispersed into the photosensitive resin composition 3 for forming a semiconductor element protection film is removed for making porous, and then is cured, thus obtaining the porous resin for protecting a semiconductor element. In this manner, by forming a protection film 7 of a silicon wafer 1, permittivity and modulus of elasticity can be reduced, and reliability can be further improved. |
