| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate plating device which can improve the in-plain uniformity of the thickness of a plated film and, at the same time, can save a plating solution by forming a smooth flow of the plating solution over the entire surface to be plated of a substrate and, in addition, can reduce the effect of the resistance of a seed layer. SOLUTION: This substrate plating device which performs plating by supplying the plating solution L in a plating tank 17 is provided with a three- dimensional filter 27 which is positioned closely to the surface Ws to be plated of the substrate W, with the surface of the filter 27 on the surface Ws side being arranged in nearly parallel with the surface Ws, and supplies the plating solution L through the filter 27. Since the solution L passes through the gap formed between the surface Ws and the upper surface of the filter 27 and having a low flow passage resistance, the solution L smoothly flows from the central part to the peripheral section of the substrate W through the gap and the in- plane uniformity of the thickness of the plated film is improved.
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