发明名称 DISK BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a disk bonding device which is capable of efficiently bonding disks, is simple in the constitution of a manufacturing apparatus and is capable of executing good working processes. SOLUTION: This device is provided with first and second working lines 2a and 2b for forming adhesive uncured disks which are coated with adhesives and are superposed on each other and a transporting means 3 for accepting the adhesive uncured disks successively discharged from the first and second working lines 2a and 2b, carrying the adhesive uncured disks into a photoirradiation position 20 and ejecting the adhesive cured disks cured with the adhesives after the completion of photoirradiation from the photoirradiation position 20. First and second shutters 7a and 7b which are respectively interposed in a first photoirradiation route 6 for irradiating the front surfaces of the disks 1 in the photoirradiation position 20 with light and a second photoirradiation route 6b for irradiating the rear surfaces of the disks 1 with the light and controls photoirradiation time are arranged. The periods of carrying the disks into and out of the photoirradiation position 20 by the transporting means are constant without depending upon the first and second working lines 2a and 2b. The device is provided with a control section 9 which controls the opening and closing of first and second shutters 7a and 7b according to the first and second working lines 2a and 2b accepting the adhesive uncured disks.</p>
申请公布号 JP2001216692(A) 申请公布日期 2001.08.10
申请号 JP20000024546 申请日期 2000.02.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ICHINOSE EIZO;FURUKAWA HITOSHI;WADA KENJI;FUKUNO HIROYUKI;FUKAMI NAOKI
分类号 B29C65/14;B29C65/52;G11B7/26;(IPC1-7):G11B7/26 主分类号 B29C65/14
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