| 摘要 |
<p>Method for packaging a circuit including exposed components (2) placed on a printed circuit (1), the circuit comprising microwave components (3). At least the part of the circuit that contains microwave components (3) is covered with a layer of syntactic foam (7) comprising a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material. Subsequently, the entire circuit is covered with a moisture-proof top layer (8).</p> |
