| 摘要 |
<p>A printed circuit board intended for mounting at least one integrated circuit (1) and associated decoupling capacitors (21, 22) on the same surface of the printed circuit board. The printed circuit board comprises a stack of alternate conductive and insulating layers (81-87). One of the conductive layers (81) is arranged as a first power plane. The other conductive layers (83, 85, 87) are patterned and provided with signal tracks (831, 851, 871, 872). The stack of layers includes contact holes (91, 92) connected to the first power plane (81), which are arranged for being connected to decoupling capacitors (21, 22). At least one (83) of the patterned conductive layers locally provides at least one second power plane (833) under that part of the aforesaid surface of the printed circuit board which is arranged for mounting an integrated circuit (1) thereon, and furthermore it includes power tracks (832), which form part of connecting means which are arranged for being connected to decoupling capacitors (21, 22) or which make up the connecting means (93, 94). The integrated circuit (1) can be a BGA-type integrated circuit, and the printed circuit board comprising components mounted thereon can be used advantageously in a single-chip cabel modem.</p> |
