发明名称 |
Integrated circuit package alignment feature |
摘要 |
An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
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申请公布号 |
US2001011762(A1) |
申请公布日期 |
2001.08.09 |
申请号 |
US20010819874 |
申请日期 |
2001.03.28 |
申请人 |
CORISIS DAVID J.;REYNOLDS TRACY;SLAUGHTER MICHAEL;CRAM DANIEL;NEVILL LELAND R.;KING JERROLD L. |
发明人 |
CORISIS DAVID J.;REYNOLDS TRACY;SLAUGHTER MICHAEL;CRAM DANIEL;NEVILL LELAND R.;KING JERROLD L. |
分类号 |
G01R1/04;G01R31/28;H01L23/495;H01L23/544;H05K3/30;(IPC1-7):H01L23/495;H01L23/48;H01L23/52;H01L23/28 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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