| 摘要 |
<p>An apparatus is provided for mounting electronic devices such as film parts accurately and efficiently on a substrate such as a glass substrate. While moving along the edge of the glass substrate (31), a measuring instrument (21) measures the distance to the glass substrate (31) in predetermined positions. The results of measurement by the measuring instrument (21) are sent to a control device (22), which determines the deformation of the glass substrate (31) based on the results of measurement, and the suction of suction pads (12) of a substrate conveyor unit (10) is controlled. The glass substrate (31) conveyed by the substrate conveyor unit (10) receives downward forces from the suction pads (12), and receives upward forces from support pins (13). Consequently, local warpage of the glass substrate (31) is corrected, while the glass substrate (31) is kept at even height with respect to the upper ends of the support pins (13).</p> |
