PACKAGE FOR MICROWAVE COMPONENTS

摘要

Method for packaging a circuit including exposed components (2) placed on a printed circuit (1), the circuit comprising microwave components (3). At lea st the part of the circuit that contains microwave components (3) is covered wi th a layer of syntactic foam (7) comprising a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material. Subsequentl y, the entire circuit is covered with a moisture-proof top layer (8).