发明名称 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
摘要 <p>A polymeric compound for photoresists which comprises monomer units represented by formula (I); and a resin composition for photoresists which comprises the polymeric compound and a photo-acid generator. The composition has high adhesion to substrates and can precisely form a fine pattern.</p>
申请公布号 WO2001057597(P1) 申请公布日期 2001.08.09
申请号 JP2001000515 申请日期 2001.01.26
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