Semiconductor device for integrated circuits esp. with reference to housing technology, uses first and second contact pads, and has the electrically connected external connections

摘要

A semiconductor device or component based on the so-called interposer concept is improved in its overall design by joining the 'interposer' (30) to the frontal face of the chip unit (10) such that its at least one centrally positioned rectangular penetration or gap (36) is positioned over the first pad (18) of the chip unit (10). The 'interposer' serves for electrical connection of the semiconductor device or component to the circuit board and for this reason has external connections (40) on its front face (32).