首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHODS AND COMPOSITIONS FOR IMPROVING INTERCONNECT METALLIZATION PERFORMANCE IN INTEGRATED CIRCUITS
摘要
申请公布号
KR20010074707(A)
申请公布日期
2001.08.09
申请号
KR1020017000537
申请日期
2001.01.12
申请人
发明人
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Stromspule fuer Elektrizitaetszaehler
Verfahren zur Herstellung eines Sinterwerkstoffes fuer elektrische Kontakte
Verfahren zum Versiegeln von Fussboeden mit einem organische Poymerisate als Bindemittel enthaltenden Lack
Bandfangspule
Manufacture of metal-pyridine interaction products and bipyridyls
New polycyclic lactones and keto-acids derived therefrom
Ether-ketones and methods for their preparation
Improved method of detecting moisture in insulation material of an electrical winding
Fault location arrangement
Magnetostrictive transducer
Improvements in or relating to the cleaning of pipelines adapted to convey concrete
Improvements in or relating to superconductive nbsn wire
Radio frequency signal defect suppressor
Improvements in and relating to cribs
Improvements in venetian blinds
Coal plough
Water-insoluble azo dyestuffs containing nitrophenyl-hydrazone residues
Apparatus for forming annular workpieces
Lens system
Electric cable gland assembly