发明名称 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
摘要 In a semiconductor memory device having a memory cell section and a peripheral circuit section, a cell plate is formed so as to be opposed to a storage node for charge storage of the memory cell by using a low-resistivity conductive layer. In the peripheral circuit section, a signal line is formed from the same low-resistivity conductive layer. As a result, a level difference between the memory cell section and the peripheral circuit section after the memory cell formation can be reduced.
申请公布号 US2001011741(A1) 申请公布日期 2001.08.09
申请号 US19980123455 申请日期 1998.07.28
申请人 URABE TAKASHI 发明人 URABE TAKASHI
分类号 H01L27/108;H01L21/8242;(IPC1-7):H01L27/108;H01L29/76;H01L29/94 主分类号 H01L27/108
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