KOSTENGÜNSTIGES HOCHLEISTUNGSGEHÄUSE FÜR MIKROWELLENSCHALTUNGEN IM 90 GHZ-BEREICH MIT BGA EIN/AUSGANGSFORMAT UND KERAMISCHER SUBSTRATTECHNOLOGIE

摘要

A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an [s] matrix close to within the operating frequency band of the package, for any pair of signal transmission ports.