A METHOD AND APPARATUS FOR IMPLANTING SEMICONDUCTOR WAFER SUBSTRATES,申请号WO2001GB00459-传众专利搜索

发明名称	A METHOD AND APPARATUS FOR IMPLANTING SEMICONDUCTOR WAFER SUBSTRATES
摘要	A gripper for loading wafers onto an implant wheel W and removing them from the wheel. The gripper having a substrate engaging mechanism (14) for engaging the substrate and a means for rotating this substrate engaging mechanism, such that wafers can be removed from the implant wheel, rotated to a second orientation and replaced without leaving the process chamber.
申请公布号	WO0157908(A2)	申请公布日期	2001.08.09
申请号	WO2001GB00459	申请日期	2001.02.05
申请人	APPLIED MATERIALS, INC.;HOLTAM, TRISTAN, RICHARD;COOKE, RICHARD;EDWARDS, PETER;PAFFETT, GEOFFREY, DENNIS;MARMIE, LIONEL	发明人	HOLTAM, TRISTAN, RICHARD;COOKE, RICHARD;EDWARDS, PETER;PAFFETT, GEOFFREY, DENNIS;MARMIE, LIONEL
分类号	H01J37/317;H01L21/687;(IPC1-7):H01J37/00	主分类号	H01J37/317
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