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发明名称
Method for wafer polishing and method for polishing-pad dressing
摘要
申请公布号
EP0888846(A3)
申请公布日期
2001.08.08
申请号
EP19980111538
申请日期
1998.06.23
申请人
MATSUSHITA ELECTRONICS CORPORATION
发明人
HASHIMOTO, SHIN;HIDAKA, YOSHIHARU
分类号
B24B37/04;B24B53/007;H01L21/304;(IPC1-7):B24B1/00;B24B53/00
主分类号
B24B37/04
代理机构
代理人
主权项
地址
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