发明名称 |
Process for manufacturing a multilayer |
摘要 |
The method involves applying a localized high temperature to fix at least two inner layers (10), which are separated by an insulating adhesive layer (14), at discrete points within a multilayer circuit board (11), with the inner layers pressed together during application of the localized high temperature, e.g. using heating pins (36). |
申请公布号 |
EP0971571(A3) |
申请公布日期 |
2001.08.08 |
申请号 |
EP19990112236 |
申请日期 |
1999.06.25 |
申请人 |
MASCHINENFABRIK LAUFFER;HEWLETT-PACKARD COMPANY |
发明人 |
DIPPON, SIEGFRIED;STENKER, JENS;PLOCHER, WERNER |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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