发明名称 |
Megasonic plating using a submerged transducers-array |
摘要 |
<p>A megasonic plating technique employs a submerged megasonic transducer array (22) to create a ridge (38) of electrolyte that extends upward above a plating tray (12). A chuck (40) holds the substrate (42) so the face to be plated is oriented downwards. A controlled power supply (32) for the megasonic transducer array (22) energizes selected transducer cells (36) to create the ridge (38) of electrolyte and causes it to move or walk across the face of the substrate. This technique avoids need for drive mechanisms for either the tray (12) or the chuck (40). A annular anode element (24) may be positioned above the transducer array, and may be a consumable anode. This technique may be used for electroplating, electroless plating, or for other wet chemistry techniques such as planing or etching. <IMAGE></p> |
申请公布号 |
EP1122339(A2) |
申请公布日期 |
2001.08.08 |
申请号 |
EP20010300587 |
申请日期 |
2001.01.23 |
申请人 |
REYNOLDS TECH FABRICATORS, INCORPORATED |
发明人 |
REYNOLDS, HAROLD VINCENT |
分类号 |
C23C18/31;C23C18/16;C23F1/08;C25D5/08;C25D5/20;C25D7/12;C25D17/00;C25D21/00;H01L21/288;(IPC1-7):C25D5/20 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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